E1490C

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Keysight/Agilent E1490C, C-Size, 1.75 Watts, Register-Based Breadboard Module

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Keysight Agilent HP - VXIbus VMEbus - E1490C
Keysight Agilent HP - VXIbus VMEbus - E1490C - Wiring
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Keysight/Agilent E1490C Register-Based Breadboard Module

The Keysight/Agilent E1490C is a C size register based breadboard module designed for VXI mainframe systems. It provides a reliable and structured interface to the VXI backplane for custom hardware development. The model enables engineers to construct proprietary circuit designs within a standard VXI mainframe environment. Its backplane interface circuitry fully complies with the documented requirements of the VXIbus System Specification. The module delivers a VXI A16/D16 register based backplane interface supported by integrated metal shielding. All user-mounted components are mechanically protected by this shielding, which also encloses the printed circuit board. The model is set up to communicate directly with the VXI mainframe as an A16/D16 device. The interface circuitry is fully implemented and accessible as required by the VXIbus System Specification.

The Register Based Breadboard Module provides a user component area of 490 cm² (76 square inches) for custom circuit placement. The grid holes across the board are spaced at uniform intervals of 2.54 mm (0.1 inch) center to center. Each grid hole has an inside diameter of 1.17 mm (0.046 inch) to accommodate standard component leads. The methodical and reproducible arrangement of components throughout the entire breadboard surface area is supported by this uniform layout. The E1490C's component height above the PC board cannot be greater than 18.0 mm (0.71 inch). The lead length extending below the PC board surface is limited to a maximum of 3.2 mm (0.125 inch). These dimensional constraints ensure all user assemblies remain within the defined physical clearance boundaries of the module. The terminal module connector on the module handles a maximum continuous current of 1.0 Ampere. When current is routed through PC board traces the maximum allowable current drops to 100 milliamperes. This derating requirement applies to every signal path routed through copper traces in the user component area.

The power dissipation for the E1490C Register Based Breadboard Module is determined by the cooling capacity of the host VXI mainframe. The onboard backplane interface circuitry independently consumes a fixed 1.75 watts under normal operating conditions. The total module power dissipation must remain within the watts per slot cooling capacity available in the installed mainframe.

E1490C Technical Specifications
ModelE1490C
ManufacturerKeysight
Legacy ManufacturerAgilent
Part TypeRegister-Based Breadboard
User Component Area490 Cm², 76 Inches²
Grid Hole Spacing2.54 Mm, 0.1 Inch
Grid Hole Inside Diameter1.17 Mm, 0.046 Inch
Maximum Component Height18.0 Mm Above Board
Maximum Lead Length3.2 Mm Below Board
Maximum Power DissipationMainframe Cooling Dependent

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